3D NAND flash

3D NAND flash is a type of flash memory that stacks memory cells on top of each other.

3D NAND flash is a type of flash memory that stacks memory cells on top of each other.

Stacking cells vertically has several benefits: it provides a higher capacity/volume ratio in a smaller physical space and improves electrical performance by shortening the interconnect length between cells (which also reduces power consumption).

Several vendors, including Samsung, Toshiba and IBM, are working on developing 3D NAND flash as a form factor. It is expected that 3D NAND flash will become available commercially by 2014.

This was first published in January 2012

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